|
Forum: Pentax K-1 & K-1 II
03-22-2016, 04:24 AM
|
| |
The sensor silicon chip must be mounted to a substrate - it can't stay alone,
On this substrate are the leads to transport the signals to the electronics and the landing pads for the gold bonds to the silicon.
The substrate is also needed to distribute and to lead of the heat from the sensor.
The quality of the substrate can make a big difference according to the noise - the way the landing pads are positioned, the ground connections in number an size.
When you are right, that Pentax had defined their own substrate that can make a difference in heat dissipation - heat dissipation is a principal problem for this sensors because they are mounted in the SR Unit with only small possibilities to transport the heat to the body and away from the sensor. (But Pentax solved this in a very good way with all cameras).
|
|
Forum: Pentax K-1 & K-1 II
03-10-2016, 07:46 AM
|
| |
As far as I know, are the analog digital converters and the analog amplifiers part of the sensor chip. In modern designs these parameters can be altered by configuration, by using different contacts on the chip (bonding process) or selecting different amplifications on the chip using some configuration pins, or loading some configurationsinformation by JTAG. By this way both companies can us the same chip and get different results - this is a question of processing in the camera. As an example one company will select a higher base amplification with some more noise - but higher ISO , the other a lower amplification getting less noise.
|
